TSMC lays out roadmap for massive, kilowatt-class chip packages and terabit optical links
Starting with the chip packaging tech, which TSMC has branded “CoWoS” (Chip-on-Wafer-on-Substrate), it’s essentially an enhanced version of typical chiplet designs, where multiple smaller dies are integrated together into one package. But TSMC is taking it to incredible new levels of scale and complexity.
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