While the X570 is an in-house development by AMD, the B550 is sourced from ASMedia, and is expected to be a new version of the “Promontory-LP” silicon. The only thing that sets this chip apart from the 400-series “Promontory-LP” is PCI-Express gen 3.0 certification. The chipset talks to the AM4 SoC over a PCI-Express 3.0 x4 link, and puts out up to 8 PCI-Express gen 3.0 downstream lanes. A 3rd gen Ryzen processor on a B550 motherboard still puts out PCI-Express gen 4.0 connectivity, which means you get one PCI-Express 4.0 x16 slot, and one M.2 slot with PCI-Express 4.0 x4 wiring. The rest of the chipset’s I/O will be similar to the 400-series, which includes six SATA 6 Gbps ports, up to two 10 Gbps USB 3.1 ports, up to four 5 Gbps USB 3.1 ports, and eight USB 2.0/1.1 ports. If the AM4 SoC installed is a 3rd gen Ryzen, then you’ll get a couple more 10 Gbps USB 3.1 ports. AMD could use the opportunity to launch some of the more upscale B550 motherboards with the latest 2.5 GbE wired LAN, and 802.11ax Wi-Fi 6.
This post has been read 131 times!